Global Semiconductor Challenges – EUV, 450mm. Post-CMOS
Global Semiconductor Challenges – EUV, 450mm. Post-CMOS. Development and Technology Intercept Targets. Early Development of Silicon and factory integration / automation standards, interoperability test beds for component and standards verification; early tool development. ISMI 32/22 nm Equipment Performance Metrics. Test Wafers to support development and demo. 14 nm for G450C Demonstrations
